"The innovations unveiled today will not only enable Intel's product roadmap they will also be critical for our foundry customers." "Building on Intel's unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025," Intel CEO Pat Gelsinger said during a webcast Monday. ![]() Intel also shared the process and packaging technology roadmap that will take its product development through 2025, detailing new innovations and a new naming structure for its process nodes. At the event, Intel presented the company's future process and packaging technology roadmaps.Īs Intel launches its new foundry business, its first customers include Qualcomm and Amazon Web Services, the chipmaker said Monday. Intel's new RibbonFET technology, the company's implementation of a gate-all-around transistor, is displayed as part of the "Intel Accelerated" event on July 26, 2021.
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